Agusutrisno, A. K. Rivai, E. Suharyadi, M. Mardiyanto, M. A. Shulhany
{"title":"利用脉冲激光沉积在硅衬底上生长钇稳定氧化锆薄层","authors":"Agusutrisno, A. K. Rivai, E. Suharyadi, M. Mardiyanto, M. A. Shulhany","doi":"10.1109/ICIEE49813.2020.9276976","DOIUrl":null,"url":null,"abstract":"Researches of a thin layer are one of the main studies in the materials on electronics. The deposition process of the yttria-stabilized zirconia (YSZ) thin film on a silicon wafer sub-strate (100) was carried out using pulsed laser deposition (PLD). The thin layer is grown for 50 minutes within frequency 10 Hz, pressure in the range 200-225 mTorr, Treatment of temperature in the silicon wafer as a deposit is 800°C. Furthermore, samples were characterized using an atomic force microscope (AFM), X-ray diffractometer (XRD), scanning electron microscope – energy dispersive spectroscope (SEM-EDS). This research shows that the thin film formed contains Zr4+ and Y3+ with the cubic and tetragonal phase crystal structure. The characterization of the roughness of thin film was very smoothly formed, with the range has 28 nm.","PeriodicalId":127106,"journal":{"name":"2020 2nd International Conference on Industrial Electrical and Electronics (ICIEE)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Growth of Yttria-Stabilized Zirconia Thin Layer on Silicon Wafer Substrate (100) Using Pulsed Laser Deposition\",\"authors\":\"Agusutrisno, A. K. Rivai, E. Suharyadi, M. Mardiyanto, M. A. Shulhany\",\"doi\":\"10.1109/ICIEE49813.2020.9276976\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Researches of a thin layer are one of the main studies in the materials on electronics. The deposition process of the yttria-stabilized zirconia (YSZ) thin film on a silicon wafer sub-strate (100) was carried out using pulsed laser deposition (PLD). The thin layer is grown for 50 minutes within frequency 10 Hz, pressure in the range 200-225 mTorr, Treatment of temperature in the silicon wafer as a deposit is 800°C. Furthermore, samples were characterized using an atomic force microscope (AFM), X-ray diffractometer (XRD), scanning electron microscope – energy dispersive spectroscope (SEM-EDS). This research shows that the thin film formed contains Zr4+ and Y3+ with the cubic and tetragonal phase crystal structure. The characterization of the roughness of thin film was very smoothly formed, with the range has 28 nm.\",\"PeriodicalId\":127106,\"journal\":{\"name\":\"2020 2nd International Conference on Industrial Electrical and Electronics (ICIEE)\",\"volume\":\"73 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 2nd International Conference on Industrial Electrical and Electronics (ICIEE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICIEE49813.2020.9276976\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 2nd International Conference on Industrial Electrical and Electronics (ICIEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIEE49813.2020.9276976","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Growth of Yttria-Stabilized Zirconia Thin Layer on Silicon Wafer Substrate (100) Using Pulsed Laser Deposition
Researches of a thin layer are one of the main studies in the materials on electronics. The deposition process of the yttria-stabilized zirconia (YSZ) thin film on a silicon wafer sub-strate (100) was carried out using pulsed laser deposition (PLD). The thin layer is grown for 50 minutes within frequency 10 Hz, pressure in the range 200-225 mTorr, Treatment of temperature in the silicon wafer as a deposit is 800°C. Furthermore, samples were characterized using an atomic force microscope (AFM), X-ray diffractometer (XRD), scanning electron microscope – energy dispersive spectroscope (SEM-EDS). This research shows that the thin film formed contains Zr4+ and Y3+ with the cubic and tetragonal phase crystal structure. The characterization of the roughness of thin film was very smoothly formed, with the range has 28 nm.