采用高速率μc-Si薄膜在Gen. 5.5大面积玻璃衬底上制备高转换效率a-Si/μc-Si串联太阳能组件的研究进展

Y. Aya, H. Katayama, M. Matsumoto, M. Hishida, W. Shinohara, I. Yoshida, A. Kitahara, H. Yoneda, A. Terakawa, M. Iseki
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引用次数: 2

摘要

制备高质量、高可靠性、高沉积速率的μc-Si薄膜太阳能组件是实现低成本、高转换效率a- si /μc-Si串联结构太阳能组件产业化的关键技术。三洋解决了这一问题,开发了一种新颖的CVD技术,称为局部等离子体约束CVD和一种新的μc-Si薄膜评价方法。A -si /μc-Si串联结构太阳能组件的转换效率稳定在10.0%,μc-Si薄膜在Gen. 5.5全尺寸玻璃衬底上的沉积速率为2.4 nm/s。为了获得更高转换效率的a- si /μc-Si串联结构太阳能组件,对μc-Si薄膜进行了基础研究,在大面积玻璃衬底上实现了10.5%的稳定转换效率(初始太阳能组件转换效率为12.0%)。此外,在这一发展的研究中,最高稳定转换效率为12.0%(初始转换效率为13.5%)。通过IEC 61646 Ed. 2验证的模块可靠性测试表明,该模块的性能是适应的。这些高性能的a-Si/μc-Si串联结构太阳能组件是利用我们的薄膜和组件技术知识制备的。
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Progress in the development of high-conversion-efficiency a-Si/μc-Si tandem solar module using μc-Si thin film with high deposition rate on Gen. 5.5 large-area glass substrate
The technology to make high-quality, high-reliability solar modules with a high deposition rate for μc-Si thin-film is a problem for the industrialization of low-cost, high-conversion-efficiency a-Si/μc-Si tandem structure solar modules. Sanyo has solved this problem by developing an original CVD technique called Localized Plasma Confinement CVD and a new evaluation method for μc-Si thin film. A stabilized conversion efficiency of 10.0% was achieved for an a-Si/μc-Si tandem structure solar module, and a deposition rate of 2.4 nm/s for μc-Si thin-film was attained on a Gen. 5.5 full-size glass substrate. To obtain a higher conversion-efficiency a-Si/μc-Si tandem structure solar module, fundamental studies of μc-Si thin-film have been performed, and a stabilized conversion efficiency of 10.5% (Initial solar module conversion efficiency: 12.0%) has been achieved on a large-area glass substrate. Furthermore, in the study of this development, the highest stabilized conversion efficiency of 12.0% (Initial conversion-efficiency: 13.5%) was attained. Module reliability tests confirmed by IEC 61646 Ed. 2 revealed that the performance of the module is adapted. These high-performance a-Si/μc-Si tandem structure solar modules were prepared by using the knowledge of our thin-film and module technologies.
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