深亚微米时代精度、公差与补偿的关系

D. Hill, A. Domic
{"title":"深亚微米时代精度、公差与补偿的关系","authors":"D. Hill, A. Domic","doi":"10.1109/ASIC.1997.616986","DOIUrl":null,"url":null,"abstract":"Historically, ASIC solutions tended to be effective because the physics and scale of most production technologies allowed circuit designers (and circuit design tools) to safely abstract physical properties: the size and performance of chips could largely be predicted based on logical structure alone. But those days are going fast, and with the advent of 500 K+ gate chips in deep sub-micron (DSM) technologies, new approaches must be found, This paper starts with some background in technology trends, and then reviews the traditional \"over the wall\" methodology. Section 3 then proposes a \"limited loops\" design flow based on estimation, floorplanning, and the effective cooperation of synthesis and gate-level placement technologies. This flow is discussed from the perspective of error in the estimation processes and the ability of subsequent steps to tolerate and compensate for the error.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"352 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On the relationship among accuracy, tolerance and compensation in the deep sub-micron era\",\"authors\":\"D. Hill, A. Domic\",\"doi\":\"10.1109/ASIC.1997.616986\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Historically, ASIC solutions tended to be effective because the physics and scale of most production technologies allowed circuit designers (and circuit design tools) to safely abstract physical properties: the size and performance of chips could largely be predicted based on logical structure alone. But those days are going fast, and with the advent of 500 K+ gate chips in deep sub-micron (DSM) technologies, new approaches must be found, This paper starts with some background in technology trends, and then reviews the traditional \\\"over the wall\\\" methodology. Section 3 then proposes a \\\"limited loops\\\" design flow based on estimation, floorplanning, and the effective cooperation of synthesis and gate-level placement technologies. This flow is discussed from the perspective of error in the estimation processes and the ability of subsequent steps to tolerate and compensate for the error.\",\"PeriodicalId\":300310,\"journal\":{\"name\":\"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)\",\"volume\":\"352 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-09-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1997.616986\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1997.616986","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

从历史上看,ASIC解决方案往往是有效的,因为大多数生产技术的物理和规模允许电路设计人员(和电路设计工具)安全地抽象物理特性:芯片的尺寸和性能在很大程度上可以仅根据逻辑结构来预测。但时间很快就过去了,随着深亚微米(DSM)技术中500k +栅极芯片的出现,必须找到新的方法。本文从技术趋势的一些背景开始,然后回顾传统的“翻墙”方法。然后,第3节提出了基于估算、平面规划以及综合和门级放置技术的有效合作的“有限循环”设计流程。从估计过程中的误差以及后续步骤容忍和补偿误差的能力的角度来讨论这个流程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
On the relationship among accuracy, tolerance and compensation in the deep sub-micron era
Historically, ASIC solutions tended to be effective because the physics and scale of most production technologies allowed circuit designers (and circuit design tools) to safely abstract physical properties: the size and performance of chips could largely be predicted based on logical structure alone. But those days are going fast, and with the advent of 500 K+ gate chips in deep sub-micron (DSM) technologies, new approaches must be found, This paper starts with some background in technology trends, and then reviews the traditional "over the wall" methodology. Section 3 then proposes a "limited loops" design flow based on estimation, floorplanning, and the effective cooperation of synthesis and gate-level placement technologies. This flow is discussed from the perspective of error in the estimation processes and the ability of subsequent steps to tolerate and compensate for the error.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Low power optimization of bit-serial digital filters Applying functional decomposition for depth minimal technology mapping of multiplexer based FPGAs Layout verification to improve ESD/latchup immunity of scaled-down CMOS cell libraries A MAGFET sensor array for digital magnetic signal reading Low voltage and low power design of microwave mixer
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1