{"title":"基于铝锭翻转装置的铝锭夹紧过程动力学建模与分析","authors":"Li Hua, L. Wei, Zhao Rong","doi":"10.1109/ISAM.2013.6643492","DOIUrl":null,"url":null,"abstract":"The problems of dropping ingot and locking ingot that there are when the aluminum ingot flip Device is working were analyzed. The kinematical analysis and dynamic analysis on aluminum ingot clamping process were carried out. The relationship between the working reliability of flip device and the aluminum ingot pose before the aluminum ingot accessing flip device was obtained. The constraint conditions of aluminum ingot accessing flip device were given. This paper provided key technical parameters to the research and development of aluminum ingot pose self-tuning device.","PeriodicalId":323666,"journal":{"name":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Aluminum ingot clamping process dynamics modeling and analysis based on the aluminum ingot flip Device\",\"authors\":\"Li Hua, L. Wei, Zhao Rong\",\"doi\":\"10.1109/ISAM.2013.6643492\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The problems of dropping ingot and locking ingot that there are when the aluminum ingot flip Device is working were analyzed. The kinematical analysis and dynamic analysis on aluminum ingot clamping process were carried out. The relationship between the working reliability of flip device and the aluminum ingot pose before the aluminum ingot accessing flip device was obtained. The constraint conditions of aluminum ingot accessing flip device were given. This paper provided key technical parameters to the research and development of aluminum ingot pose self-tuning device.\",\"PeriodicalId\":323666,\"journal\":{\"name\":\"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAM.2013.6643492\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Symposium on Assembly and Manufacturing (ISAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAM.2013.6643492","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Aluminum ingot clamping process dynamics modeling and analysis based on the aluminum ingot flip Device
The problems of dropping ingot and locking ingot that there are when the aluminum ingot flip Device is working were analyzed. The kinematical analysis and dynamic analysis on aluminum ingot clamping process were carried out. The relationship between the working reliability of flip device and the aluminum ingot pose before the aluminum ingot accessing flip device was obtained. The constraint conditions of aluminum ingot accessing flip device were given. This paper provided key technical parameters to the research and development of aluminum ingot pose self-tuning device.