计算机硬盘基板抛光和电镀的残余应力和工件变形

B. Klamecki
{"title":"计算机硬盘基板抛光和电镀的残余应力和工件变形","authors":"B. Klamecki","doi":"10.1115/1.2830572","DOIUrl":null,"url":null,"abstract":"Residual stress distributions due to plating and polishing were determined for nickel-phosphorus plated aluminum alloy disks. Knowledge of these stresses provides insight into the material deformation and removal processes, information as to the effects of processing conditions on residual stress magnitude and can also serve as a basis for development of models of material deformation and removal in polishing. Measured disk shape data was fitted to an analytical solution for plate displacement due to bending moments, and residual stresses were calculated. Plating and polishing residual stresses were separated. Polishing residual stress is compressive indicating differential plastic deformation between the surface and interior regions of the workpiece. Residual stresses produced in polishing operations in which process motions were constrained so that polishing was unidirectional were measured. The results show large differences between amounts of deformation in the polishing direction and the direction perpendicular to it.","PeriodicalId":432053,"journal":{"name":"Manufacturing Science and Engineering: Volume 1","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Residual Stresses and Workpiece Deformation due to Polishing and Plating of Computer Hard Disk Substrates\",\"authors\":\"B. Klamecki\",\"doi\":\"10.1115/1.2830572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Residual stress distributions due to plating and polishing were determined for nickel-phosphorus plated aluminum alloy disks. Knowledge of these stresses provides insight into the material deformation and removal processes, information as to the effects of processing conditions on residual stress magnitude and can also serve as a basis for development of models of material deformation and removal in polishing. Measured disk shape data was fitted to an analytical solution for plate displacement due to bending moments, and residual stresses were calculated. Plating and polishing residual stresses were separated. Polishing residual stress is compressive indicating differential plastic deformation between the surface and interior regions of the workpiece. Residual stresses produced in polishing operations in which process motions were constrained so that polishing was unidirectional were measured. The results show large differences between amounts of deformation in the polishing direction and the direction perpendicular to it.\",\"PeriodicalId\":432053,\"journal\":{\"name\":\"Manufacturing Science and Engineering: Volume 1\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Manufacturing Science and Engineering: Volume 1\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/1.2830572\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Manufacturing Science and Engineering: Volume 1","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.2830572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

测定了镀镍磷铝合金盘的电镀和抛光残余应力分布。这些应力的知识提供了对材料变形和去除过程的深入了解,以及加工条件对残余应力大小影响的信息,也可以作为开发抛光材料变形和去除模型的基础。将测量到的圆盘形状数据拟合到由弯矩引起的板位移解析解中,并计算了残余应力。分离了电镀和抛光残余应力。抛光残余应力是压缩的,表明工件表面和内部区域之间的塑性变形差异。测量了抛光过程中产生的残余应力,其中加工运动受到约束,因此抛光是单向的。结果表明,在抛光方向上的变形量与垂直于抛光方向上的变形量存在较大差异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Residual Stresses and Workpiece Deformation due to Polishing and Plating of Computer Hard Disk Substrates
Residual stress distributions due to plating and polishing were determined for nickel-phosphorus plated aluminum alloy disks. Knowledge of these stresses provides insight into the material deformation and removal processes, information as to the effects of processing conditions on residual stress magnitude and can also serve as a basis for development of models of material deformation and removal in polishing. Measured disk shape data was fitted to an analytical solution for plate displacement due to bending moments, and residual stresses were calculated. Plating and polishing residual stresses were separated. Polishing residual stress is compressive indicating differential plastic deformation between the surface and interior regions of the workpiece. Residual stresses produced in polishing operations in which process motions were constrained so that polishing was unidirectional were measured. The results show large differences between amounts of deformation in the polishing direction and the direction perpendicular to it.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Dynamic Measurement of CNC Part Paths A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems CBGA Solder Fillet Shape Prediction and Design Optimization Feasible Machining Strip Evaluation for 5-Axis CNC Die and Mold Machining Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1