{"title":"纳米结构体热电材料及其性能","authors":"E. Lee, J. Ryu, S. Bhattacharya, T. Tritt","doi":"10.1109/ICT.2005.1519941","DOIUrl":null,"url":null,"abstract":"Advanced bulk thermoelectric materials have been developed by fabricating composites of uniformly distributed thermoelectric nanoparticles within a high surface area semiconductor matrix. In this composite structure, constituents of the thermoelectric materials' figure of merit can be decoupled and controlled independently, and consequently, one can achieve a high thermoelectric figure of merit. The produced composites exhibited extremely low thermal conductivity and relatively high electrical conductivity. However, the Seebeck coefficient was relatively low, probably due to poor quality of the thermoelectric particles. In an in-plane test geometry (van der Pauw configuration), the electrical resistivity of the composite sample decreased continuously as temperature increased, a typical semiconductor behavior. In the perpendicular-to-the-plane (cross-plane) test geometry, electrical resistance of the sample increased continuously with increasing temperature, probably a semi-metallic behavior. This anisotropy in the electrical resistance was reproducible. We also observed relatively strong high frequency AC-signals in the in-plane test geometry samples.","PeriodicalId":422400,"journal":{"name":"ICT 2005. 24th International Conference on Thermoelectrics, 2005.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Nanostructured bulk thermoelectric materials and their properties\",\"authors\":\"E. Lee, J. Ryu, S. Bhattacharya, T. Tritt\",\"doi\":\"10.1109/ICT.2005.1519941\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Advanced bulk thermoelectric materials have been developed by fabricating composites of uniformly distributed thermoelectric nanoparticles within a high surface area semiconductor matrix. In this composite structure, constituents of the thermoelectric materials' figure of merit can be decoupled and controlled independently, and consequently, one can achieve a high thermoelectric figure of merit. The produced composites exhibited extremely low thermal conductivity and relatively high electrical conductivity. However, the Seebeck coefficient was relatively low, probably due to poor quality of the thermoelectric particles. In an in-plane test geometry (van der Pauw configuration), the electrical resistivity of the composite sample decreased continuously as temperature increased, a typical semiconductor behavior. In the perpendicular-to-the-plane (cross-plane) test geometry, electrical resistance of the sample increased continuously with increasing temperature, probably a semi-metallic behavior. This anisotropy in the electrical resistance was reproducible. We also observed relatively strong high frequency AC-signals in the in-plane test geometry samples.\",\"PeriodicalId\":422400,\"journal\":{\"name\":\"ICT 2005. 24th International Conference on Thermoelectrics, 2005.\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICT 2005. 24th International Conference on Thermoelectrics, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICT.2005.1519941\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICT 2005. 24th International Conference on Thermoelectrics, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICT.2005.1519941","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
通过在高表面积的半导体基体中制备均匀分布的热电纳米颗粒复合材料,已经开发出先进的块状热电材料。在这种复合结构中,热电材料的各组分的性能因数可以独立地解耦和控制,从而可以实现高热电性能因数。所制备的复合材料具有极低的导热性和相对较高的导电性。然而,塞贝克系数相对较低,可能是由于热电粒子的质量较差。在平面内测试几何(van der Pauw结构)中,复合材料样品的电阻率随着温度的升高而持续下降,这是典型的半导体行为。在垂直于平面(交叉平面)的测试几何形状中,样品的电阻随着温度的升高而不断增加,可能是一种半金属行为。电阻的这种各向异性是可重复的。我们还在平面内测试几何样品中观察到相对较强的高频交流信号。
Nanostructured bulk thermoelectric materials and their properties
Advanced bulk thermoelectric materials have been developed by fabricating composites of uniformly distributed thermoelectric nanoparticles within a high surface area semiconductor matrix. In this composite structure, constituents of the thermoelectric materials' figure of merit can be decoupled and controlled independently, and consequently, one can achieve a high thermoelectric figure of merit. The produced composites exhibited extremely low thermal conductivity and relatively high electrical conductivity. However, the Seebeck coefficient was relatively low, probably due to poor quality of the thermoelectric particles. In an in-plane test geometry (van der Pauw configuration), the electrical resistivity of the composite sample decreased continuously as temperature increased, a typical semiconductor behavior. In the perpendicular-to-the-plane (cross-plane) test geometry, electrical resistance of the sample increased continuously with increasing temperature, probably a semi-metallic behavior. This anisotropy in the electrical resistance was reproducible. We also observed relatively strong high frequency AC-signals in the in-plane test geometry samples.