采用sub-20nm技术的64Gb 533Mb/s DDR接口MLC NAND闪存

Daeyeal Lee, I. Chang, Sangyong Yoon, Joonsuc Jang, Dong-Su Jang, Wook-Ghee Hahn, Jong-Yeol Park, Doo-Gon Kim, Chiweon Yoon, Bong-Soon Lim, ByungJun Min, Sung-Won Yun, Ji-Sang Lee, I. Park, Kyung-Ryun Kim, Jeong-Yun Yun, Youse Kim, Yongdeok Cho, Kyung-Min Kang, Sanghoon Joo, Jin-Young Chun, Jung-No Im, S. Kwon, Seo-Hyeon Ham, Ansoo Park, Jaemin Yu, Nam-Hee Lee, Tae-Sung Lee, Moosung Kim, Hoosung Kim, Ki-Whan Song, B. Jeon, Kihwan Choi, Jin-Man Han, K. Kyung, Y. Lim, Young-Hyun Jun
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引用次数: 31

摘要

随着智能手机和平板电脑等移动应用市场的增长,对高密度、快速吞吐量的NAND闪存的需求呈爆炸式增长。为了满足这种需求,我们提出了一种64Gb的多级单元(MLC) NAND闪存,具有533Mb/s的DDR接口,采用sub-20nm技术。大浮栅(FG)耦合干扰和程序干扰是阻碍NAND闪存在亚20nm技术节点上规模化的主要挑战[1]。在本文中,我们提出了耦合前校正(CBC)重编程和p3模式预脉冲方案,使我们能够克服大的FG耦合干扰。我们通过发明抑制-信道耦合-减小(ICCR)技术来改善程序干扰。此外,我们采用波浪管道架构实现了533Mb/s的DDR接口[2]。
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A 64Gb 533Mb/s DDR interface MLC NAND Flash in sub-20nm technology
The market growth of mobile applications such as smart phones and tablet computers has fueled the explosive demand of NAND Flash memories having high density and fast throughput. To meet such a demand, we present a 64Gb multilevel cell (MLC) NAND Flash memory having 533Mb/s DDR interface in sub-20nm technology. Large floating-gate (FG) coupling interference and program disturbance are major challenges to impede the scaling of NAND Flash memories in sub-20nm technology node [1]. In this paper, we present correction-before-coupling (CBC) reprogram and P3-pattern pre-pulse scheme, allowing us to overcome large FG coupling interferences. We improve program disturbance by inventing inhibit-channel-coupling-reduction (ICCR) technique. In addition, we achieve a 533Mb/s DDR interface by employing a wave-pipeline architecture [2].
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