{"title":"lsi封装阵列电路板的压降特性","authors":"H. Matsushima, T. Yanagida, W. Nakayama","doi":"10.1299/KIKAIB.59.1244","DOIUrl":null,"url":null,"abstract":"Experimental investigation was performed to study the pressure drop characteristics of parallel-plate channels where model packages of various sizes are mounted. The ratio of channel height to package height and placement pitch to package height are 1.3∼2.7 and 1.8∼5.6 for packages without fins, and 1.2∼2.0 and 2.1∼3.4 for finned packages, respectively. A new flow model is proposed which incorporates the three-dimensional nature of wakes behind the packages. The predicted values of pressure drop based on this model correlate with the experimental results within ±20∼30%.","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"PRESSURE DROP CHARACTERISTICS OF CIRCUIT BOARD WITH ARRAYS OF LSI PACKAGES\",\"authors\":\"H. Matsushima, T. Yanagida, W. Nakayama\",\"doi\":\"10.1299/KIKAIB.59.1244\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Experimental investigation was performed to study the pressure drop characteristics of parallel-plate channels where model packages of various sizes are mounted. The ratio of channel height to package height and placement pitch to package height are 1.3∼2.7 and 1.8∼5.6 for packages without fins, and 1.2∼2.0 and 2.1∼3.4 for finned packages, respectively. A new flow model is proposed which incorporates the three-dimensional nature of wakes behind the packages. The predicted values of pressure drop based on this model correlate with the experimental results within ±20∼30%.\",\"PeriodicalId\":168856,\"journal\":{\"name\":\"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1299/KIKAIB.59.1244\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1299/KIKAIB.59.1244","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
PRESSURE DROP CHARACTERISTICS OF CIRCUIT BOARD WITH ARRAYS OF LSI PACKAGES
Experimental investigation was performed to study the pressure drop characteristics of parallel-plate channels where model packages of various sizes are mounted. The ratio of channel height to package height and placement pitch to package height are 1.3∼2.7 and 1.8∼5.6 for packages without fins, and 1.2∼2.0 and 2.1∼3.4 for finned packages, respectively. A new flow model is proposed which incorporates the three-dimensional nature of wakes behind the packages. The predicted values of pressure drop based on this model correlate with the experimental results within ±20∼30%.
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