PrMnO3 RRAM中挥发性开关的热工程:直流IV特性的非线性和瞬态开关速度

J. Sakhuja, S. Lashkare, V. Saraswat, U. Ganguly
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引用次数: 1

摘要

具有丝状和非丝状电阻开关(RS)机制的电阻随机存取存储器(ReRAM)器件被广泛探索用于神经形态应用,以满足当今数据密集型计算需求。在丝状rram中,依赖于电场和焦耳加热的阈值开关已经很好地建立起来(图1a)[1]。另外,电场驱动的离子输运是造成非丝状记忆特性的原因(图1b)[2]。在最近的研究中,除了离子传输外,在非细丝器件中也提出了基于自热的机制(图1c)[3]。这增强了热激活离子漂移,从而增强了器件内的开关行为。已经提出了不同的技术,如加入加热元件或隔热层(如GST)来改善堆栈内的热约束,以改善器件特性[4]。近年来,基于PMO的RRAM在其低阻态(LRS)中表现出了高度非线性的I-V特性。PMO材料具有非常低的导热系数(0.5W/m-K),这有利于热反馈导致非线性(NL)。此外,独立于增强RS, PMO-RRAM器件的两个功能已经被证明。首先,NL实现了无选择器的内存操作,这在交叉条存储阵列中非常有吸引力(图1d)[5]。其次,它有利于基于热失控NL相关NDR的振荡(图1e)[6],[7]。因此,研究和设计NL具有重要的意义。在本文中,我们通过改变隔离sio2厚度来修改PMO RRAM器件堆栈的热电路,保持RRAM结构的其他电子/离子方面相同。我们展示了直流阈值电压降低了38%,加热瞬态改善了8倍,这是对热电路工程的响应。
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Thermal Engineering of Volatile Switching in PrMnO3 RRAM: Non-Linearity in DC IV Characteristics and Transient Switching Speed
Resistive Random-Access Memory (ReRAM) devices with filamentary and non-filamentary resistive switching (RS) mechanisms are extensively explored for Neuromorphic applications to cater to the present-day dataintensive computing requirements. In filamentary RRAMs, the electric field and Joule heating dependent threshold switching is well established ( Fig. 1a ) [1] . Alternatively, electric-field driven ionic transport was responsible for nonfilamentary memory characteristics ( Fig. 1b ) [2] . In recent studies, self-heating-based mechanism in addition to ionic transport has been suggested in non-filamentary devices ( Fig. 1c ) [3] . This boosts thermally activated ionic drift, thereby enhancing the switching behavior within the device. Different techniques like the incorporation of heater elements or thermally insulating layers such as GST to improve heat confinement within the stack has been proposed to improve device characteristics [4] . Recently, highly non-linear I-V characteristics have been demonstrated in PMO based RRAM in its Low Resistance State (LRS). The PMO material has very low thermal conductivity (0.5W/m-K), which facilitates thermal feedback leading to non-linearity (NL). Further, independent of enhanced RS, two capabilities of PMO-RRAM devices have been demonstrated. Firstly, NL enabled selector-less memory operations, which are highly attractive in crossbar memory arrays ( Fig. 1d ) [5] . Secondly, it facilitates oscillations based on NL related NDR from thermal runaway( Fig. 1e ) [6] , [7] . Thus, investigating & engineering the NL is of significant interest. In this paper, we modify the thermal circuit of the PMO RRAM device stack by changing isolation SiO 2 thickness, keeping the rest of the electronic/ionic aspects of the RRAM structure identical. We show~ 38% reduction in threshold voltage in DC and an 8x improvement in heating transients as a response to thermal circuit engineering.
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