功率和面积效率高的5T-SRAM,提高了65纳米CMOS低功耗SoC的性能

Hooman Jarollahi, R. Hobson
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引用次数: 5

摘要

本文讨论了5T SRAM单元的性能和可靠性问题,并介绍了一种低功耗、可靠和高性能的65nm技术设计,可用于处理器和低功耗便携式设备的缓存存储器。与典型的6T电池相比,所提出的SRAM电池的面积减少了13%。此外,它还具有偏置接地线VSSM,该接地线由待机存储单元的通道泄漏电流充电,用于预充电单个位线并偏置每个存储单元的负电源电压以抑制待机泄漏功率。与传统的5T和6T设计相比,待机功耗大大降低,与以前的低功耗6T设计相比,待机功耗降低高达30%。所提出的设计具有读取和静态噪声边界,以及可与典型6T设计相媲美的写入' 0 '和读取性能。根据设计选择,写入“1”的速度要慢11-31%,并且可以以较小的面积和功耗成本进行改进。
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Power and area efficient 5T-SRAM with improved performance for low-power SoC in 65nm CMOS
This paper addresses performance and reliability issues in a 5T SRAM cell, and introduces a low power, reliable and high performance design in 65nm technology, which can be used as cache memory in processors and in low-power portable devices. The proposed SRAM cell features ∼13% area reduction compared to a typical 6T cell. In addition, it features a biasing ground line, VSSM, which is charged by channel leakage current from memory cells in standby, and is used to pre-charge a single bit-line and bias the negative supply voltage of each memory cell to suppress standby leakage power. A major standby power reduction is gained compared to conventional 5T and 6T designs and up to ∼30% compared to previous low-power 6T designs. The proposed design has read and static noises margins, as well as write ‘0’ and read performance that are comparable to typical 6T designs. Write ‘1’ is slower by ∼11–31% depending on design choices and can be improved with minor cost of area and power.
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