层次分析法在光刻机故障原因分析评价中的应用

Po-Sheng Ko, Cheng-Chung Wu, Hsin-Hung Chen, Chung-Wen Yang
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引用次数: 0

摘要

本研究对光刻机稳定性指标评价项进行了分层分析,建立了一套故障预测评价机制,为光刻机故障排除提供参考和指标。结果表明,当光刻机出现故障时,主要是根据以往的经验找出可能的故障原因。本研究还发现,在良好的维护系统配置下,充足的信息与良好的系统密切相关。对于半导体行业的光刻工艺,首先考虑的是破片的复杂性。因此,半导体的整个光刻过程依赖于工程师的经验。更具体地说,在现场维护中需要快速的错误解释和修复。在高技术、高成本的半导体加工竞争激烈的市场中,光刻机的及时维护是迫切而必要的。
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Application of AHP to Evaluation on Failure Causes Analysis for Lithography Machine
This study conducted hierarchical analysis on the evaluation item of the stability index of the lithography machine, and established a set of evaluation mechanism for failure prediction, in order to provide references and indicators of troubleshooting for lithography machine. The results showed, when the lithography machine is out of order, the possible failure causes are mainly be found based on the past experiences. This study also found that, under the good configuration of maintenance system, adequate information is closely associated a good system. As for lithography process in semiconductor industry, the complexity of broken Wafer is first considered. Thus, the overall lithography process of semiconductor relies on engineers’ experience. More specifically, a quick error interpretation and repair are required in field maintenance. As in a competitive market of semiconductor processing with high-tech and high-cost, a timely maintenance in the lithography machine is urgent and requested.
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