{"title":"测定介质薄膜厚度的双角度成像系统","authors":"Yang Deng, Diana Magana, Zheng Tan, J. Kruschwitz","doi":"10.1364/OIC.2019.THC.4","DOIUrl":null,"url":null,"abstract":"A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.","PeriodicalId":119323,"journal":{"name":"Optical Interference Coatings Conference (OIC) 2019","volume":"456 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Dual-Angle Imaging System (DAISy) for Determining the Thickness of a Dielectric Thin Film\",\"authors\":\"Yang Deng, Diana Magana, Zheng Tan, J. Kruschwitz\",\"doi\":\"10.1364/OIC.2019.THC.4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.\",\"PeriodicalId\":119323,\"journal\":{\"name\":\"Optical Interference Coatings Conference (OIC) 2019\",\"volume\":\"456 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optical Interference Coatings Conference (OIC) 2019\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/OIC.2019.THC.4\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical Interference Coatings Conference (OIC) 2019","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/OIC.2019.THC.4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dual-Angle Imaging System (DAISy) for Determining the Thickness of a Dielectric Thin Film
A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.
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