CMOS SRAM单元写入过程中漏电流及漏功率降低分析

K. Khare, R. Kar, D. Mandal, S. Ghoshal
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引用次数: 12

摘要

漏功率是短通道器件的主要问题。随着技术的不断缩小(即180nm、90nm、45nm)。等)泄漏电流增加非常快。因此,人们提出了几种降低CMOS数字集成电路漏损的方法和技术。泄漏功耗已成为集成电路总功耗中相当大的一部分。本文阐述了采用休眠晶体管的6T、8T和10T模型的思想。这种SRAM单元比基本的6T, 8T和10T晶体管模型具有优势。具有休眠晶体管的SRAM单元显示出比堆栈方法更好的减少漏损的方法。本文利用模拟环境virtuoso (cadence)模拟器对180nm工艺的CMOS SRAM单元的功耗进行分析。
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Analysis of leakage current and leakage power reduction during write operation in CMOS SRAM cell
Leakage power is a major issue for short channel devices. As the technology is shrinking (i.e., 180nm, 90nm, 45nm. etc.) the leakage current is increasing very fast. So, several methods and techniques have been proposed for leakage reduction in CMOS digital integrated circuits. Leakage power dissipation has become a sizable proportion of the total power dissipation in integrated circuit. This paper demonstrates the ideas of 6T, 8T and 10T models with sleep transistors. This proposed SRAM cells give the advantages over basic 6T, 8T and 10T transistor models. The SRAM cell with sleep transistor shows better leakage reduction approach than stack approaches. Here in this paper Analog environment virtuoso (cadence) simulator is used for analysis of the power associated with CMOS SRAM cell for 180nm technology.
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