{"title":"钯催化烧结钼膏在多层衬底制造中的应用","authors":"A. Kumar","doi":"10.1109/ECTC.1993.346791","DOIUrl":null,"url":null,"abstract":"This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Palladium-catalyzed sintering of molybdenum paste applied to multilayer substrate fabrication\",\"authors\":\"A. Kumar\",\"doi\":\"10.1109/ECTC.1993.346791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346791\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Palladium-catalyzed sintering of molybdenum paste applied to multilayer substrate fabrication
This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass.<>
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