PDMS和TEOS的摩尔比对其耐热性、电绝缘性和力学性能的影响

T. Oakamoto, T. Shindou, M. Sugiura, S. Nakamura
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引用次数: 1

摘要

通过改变聚二甲基硅氧烷(PDMS)和四乙氧基硅烷(TEOS)的摩尔比,研究了溶胶-凝胶反应法制备的聚二甲基硅氧烷(PDMS)和四乙氧基硅烷(TEOS)杂化材料的耐热性、电绝缘性和力学性能。结果表明,无论摩尔比如何,在200℃空气中老化480 h后,杂种材料的失重率均小于3%。在200℃下老化20,000小时后,杂种的预期重量损失小于7%。结果表明,随着摩尔比的增大,杂化材料的弹性模量和断裂应力均增大。由于在老化过程中发生了进一步的脱水和缩聚反应,这些机械性能在老化后得到了改善。随着摩尔比的增大,体积电阻率减小,介质损耗正切增大。即使在摩尔比为10时,室温下的电阻率也在1013 ω -m数量级。混合材料的相对介电常数和交流介电击穿强度分别为3和25 kV/mm。分别。老化后,杂化材料的体积电阻率、相对介电常数升高,介质损耗正切线减小,交流击穿强度变化不大。结果表明,TEOS与PDMS复合材料具有成为高耐热绝缘材料的潜力。
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Change in Heat Resistive, Electrical Insulating and Mechanical Properties of Hybrid Made with PDMS and TEOS for the Mole Ratio of Them
Heat resistive, electrical insulating and mechanical properties of hybrids made with polydimethylsiloxane (PDMS) and tetraethoxysilane (TEOS) through the sol-gel reaction method have been studied by changing the mole ratio of TEOS to PDMS. It has been found that the weight loss of the hybrids is less than 3 % regardless of the mole ratio after ageing at 200 degC for 480 h in air. The expected weight loss of the hybrids after ageing for 20,000 h at 200 degC is less than 7 %. It has been found that the elastic modulus and the stress at break of the hybrids increases with increasing the mole ratio. Those mechanical properties are improved after the ageing because of further dehydration and condensation polymerization reactions through the ageing. The volume resistivity decreases and the dielectric loss tangent increases with increasing the mole ratio. Even at the mole ratio of 10, the resistivity is in the order of 1013 ohm-m at room temperature. Relative permittivity and AC dielectric breakdown strength of the hybrids are about 3 and 25 kV/mm. respectively. After the ageing, increases of volume resistivity, relative permittivity and a decrease of dielectric loss tangent of the hybrids have been observed and AC breakdown strength of them shows little change. It has been concluded that the hybrid made with TEOS and PDMS has the potential of a higher heat resistive insulating material.
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