从粗磨到抛光的断裂和材料去除机制

J. Lambropoulos
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引用次数: 0

摘要

当在脆性材料中制造光学表面时,通常可以方便地估计所得表面的质量,而无需进行大量的制造实验。这些估计包括材料去除率,以及表面质量的典型测量,例如表面粗糙度和亚表面损伤。此外,地面可能处于残余应力状态,这将导致光学元件的整体曲率,特别是当其长径比较大时。光学制造的这些属性可以通过使用被研磨或抛光的脆性材料的一些机械特性来估计。
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Fracture and material removal mechanisms from rough grinding to polishing
When manufacturing optical surfaces in brittle materials, it is often convenient to estimate the quality of the resulting surface without extensive manufacturing experiments. Such estimates include the rate of material removal, as well as typical measures of surface quality, for example surface roughness and subsurface damage. In addition, the ground surface may be in a state of residual stress which will induce an overall curvature to an optical component, especially if its aspect ratio is large. These attributes of optics manufacturing can be estimated by using a few mechanical properties of the brittle material being ground or polished.
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