重新思考内存系统设计(以及互连)

O. Mutlu
{"title":"重新思考内存系统设计(以及互连)","authors":"O. Mutlu","doi":"10.1145/2835512.2835520","DOIUrl":null,"url":null,"abstract":"The memory system is a fundamental performance and energy bottleneck in almost all computing systems. Recent system design, application, and technology trends that require more capacity, bandwidth, efficiency, and predictability out of the memory system make it an even more important system bottleneck [27, 28]. At the same time, DRAM technology is experiencing difficult circuit and device scaling challenges that make the maintenance and enhancement of its capacity, energy-efficiency, and reliability significantly more costly with conventional techniques (see, for example [7, 8, 11, 12, 15, 17, 18, 22, 23, 32]). In this talk, we examine some promising research and design directions to overcome challenges posed by memory scaling. Specifically, we discuss three key solution directions: 1) enabling new memory architectures, functions, interfaces, and better integration of the memory and the rest of the system, including interconnects (e.g., [1, 2, 19, 20, 34-36]), 2) designing a memory system that intelligently employs multiple memory technologies and coordinates memory and storage management using non-volatile memory technologies (e.g., [16-18, 24, 25, 32, 33, 40-42]), 3) providing predictable performance and QoS to applications sharing the memory system (e.g., [3, 9, 10, 13, 14, 26, 29, 37-39]). As we discuss challenges and solution directions in memory, we will point out research opportunities in interconnects and memory-interconnect co-design (e.g., [2, 4-6, 19, 21, 30, 31]).","PeriodicalId":424680,"journal":{"name":"Proceedings of the 8th International Workshop on Network on Chip Architectures","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Rethinking Memory System Design (along with Interconnects)\",\"authors\":\"O. Mutlu\",\"doi\":\"10.1145/2835512.2835520\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The memory system is a fundamental performance and energy bottleneck in almost all computing systems. Recent system design, application, and technology trends that require more capacity, bandwidth, efficiency, and predictability out of the memory system make it an even more important system bottleneck [27, 28]. At the same time, DRAM technology is experiencing difficult circuit and device scaling challenges that make the maintenance and enhancement of its capacity, energy-efficiency, and reliability significantly more costly with conventional techniques (see, for example [7, 8, 11, 12, 15, 17, 18, 22, 23, 32]). In this talk, we examine some promising research and design directions to overcome challenges posed by memory scaling. Specifically, we discuss three key solution directions: 1) enabling new memory architectures, functions, interfaces, and better integration of the memory and the rest of the system, including interconnects (e.g., [1, 2, 19, 20, 34-36]), 2) designing a memory system that intelligently employs multiple memory technologies and coordinates memory and storage management using non-volatile memory technologies (e.g., [16-18, 24, 25, 32, 33, 40-42]), 3) providing predictable performance and QoS to applications sharing the memory system (e.g., [3, 9, 10, 13, 14, 26, 29, 37-39]). As we discuss challenges and solution directions in memory, we will point out research opportunities in interconnects and memory-interconnect co-design (e.g., [2, 4-6, 19, 21, 30, 31]).\",\"PeriodicalId\":424680,\"journal\":{\"name\":\"Proceedings of the 8th International Workshop on Network on Chip Architectures\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 8th International Workshop on Network on Chip Architectures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/2835512.2835520\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 8th International Workshop on Network on Chip Architectures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2835512.2835520","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

存储系统是几乎所有计算系统的基本性能和能量瓶颈。最近的系统设计、应用和技术趋势要求内存系统提供更多的容量、带宽、效率和可预测性,这使其成为更重要的系统瓶颈[27,28]。与此同时,DRAM技术正面临着艰难的电路和器件缩放挑战,这使得维护和增强其容量、能效和可靠性的成本明显高于传统技术(参见[7,8,11,12,15,17,18,22,23,32])。在这次演讲中,我们将探讨一些有前途的研究和设计方向,以克服内存缩放带来的挑战。具体来说,我们讨论了三个关键的解决方向:1)实现新的存储器架构、功能、接口,并更好地集成存储器和系统的其余部分,包括互连(例如,[1,2,19,20,34-36]),2)设计一种存储器系统,智能地采用多种存储器技术,并使用非易失性存储器技术(例如,[16-18,24,25,32,33,40-42])来协调存储器和存储管理,3)为共享存储器系统的应用程序提供可预测的性能和QoS(例如,[3,9,10,13,1])。[14,26,29,37 -39])。当我们讨论存储器中的挑战和解决方案方向时,我们将指出互连和存储器-互连协同设计的研究机会(例如[2,4 - 6,19,21,30,31])。
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Rethinking Memory System Design (along with Interconnects)
The memory system is a fundamental performance and energy bottleneck in almost all computing systems. Recent system design, application, and technology trends that require more capacity, bandwidth, efficiency, and predictability out of the memory system make it an even more important system bottleneck [27, 28]. At the same time, DRAM technology is experiencing difficult circuit and device scaling challenges that make the maintenance and enhancement of its capacity, energy-efficiency, and reliability significantly more costly with conventional techniques (see, for example [7, 8, 11, 12, 15, 17, 18, 22, 23, 32]). In this talk, we examine some promising research and design directions to overcome challenges posed by memory scaling. Specifically, we discuss three key solution directions: 1) enabling new memory architectures, functions, interfaces, and better integration of the memory and the rest of the system, including interconnects (e.g., [1, 2, 19, 20, 34-36]), 2) designing a memory system that intelligently employs multiple memory technologies and coordinates memory and storage management using non-volatile memory technologies (e.g., [16-18, 24, 25, 32, 33, 40-42]), 3) providing predictable performance and QoS to applications sharing the memory system (e.g., [3, 9, 10, 13, 14, 26, 29, 37-39]). As we discuss challenges and solution directions in memory, we will point out research opportunities in interconnects and memory-interconnect co-design (e.g., [2, 4-6, 19, 21, 30, 31]).
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A Low-Latency and High-Throughput Multiple-Level Arbitration Scheme Supporting Quality-of-Service in Optical On-chip Network Rethinking Memory System Design (along with Interconnects) Task mapping and communication routing model for minimizing power consumption in multi-cores Automated Power and Latency Management in Heterogeneous 3D NoCs Design of TSV-Sharing Topologies for Cost-Effective 3D Networks-on-Chip
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