斜坡输入下超大规模集成电路互连的分析延迟模型

A. Kahng, K. Masuko, S. Muddu
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引用次数: 72

摘要

Elmore延迟在VLSI路由拓扑的性能驱动合成和布局中被广泛用作互连延迟的分析估计。然而,对于带有斜坡输入的典型RLC互连,Elmore延迟可能会偏离spice计算的延迟高达100%或更多,因为它与输入斜坡信号的上升时间无关。当输入是上升时间有限的斜坡信号时,我们建立了基于互连传递函数一阶矩和二阶矩的解析延迟模型。在广泛的互连参数值范围内,使用我们基于第一矩的分析模型的延迟估计在SPICE计算的延迟的4%以内,基于第一矩和第二矩的模型在SPICE的2.3%以内。我们的分析模型的评估比使用SPICE的模拟快几个数量级。我们还描述了我们在任意互连树中估计源汇延迟的方法的扩展。
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Analytical delay models for VLSI interconnects under ramp input
Elmore delay has been widely used as an analytical estimate of interconnect delays in the performance-driven synthesis and layout of VLSI routing topologies. However, for typical RLC interconnections with ramp input, Elmore delay can deviate by up to 100% or more from SPICE-computed delay since it is independent of rise time of the input ramp signal. We develop new analytical delay models based on the first and second moments of the interconnect transfer function when the input is a ramp signal with finite rise time. Delay estimates using our first moment based analytical models are within 4% of SPICE-computed delay, and models based on both first and second moments are within 2.3% of SPICE, across a wide range of interconnect parameter values. Evaluation of our analytical models is several orders of magnitude faster than simulation using SPICE. We also describe extensions of our approach for estimation of source-sink delays in arbitrary interconnect trees.
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