{"title":"使用单探测器红外测量和三维传热建模的电子元件热表征","authors":"M. Kopeć, B. Więcek","doi":"10.23919/MIXDES49814.2020.9155993","DOIUrl":null,"url":null,"abstract":"A novel methodology of thermal impedance measurement by temperature monitoring out of the heat source in a power transistor is presented. A low-cost Infra-Red (IR) head is used to register evolution of temperature after step-function powering. A dedicated power generator has been developed to synchronize temperature recording with power dissipation in a device. Estimation of temperature in the heat source is performed by 3D FEM modelling of multilayer transistor structure. It allows fitting the measurement and simulation results to achieve the classically-defined thermal impedance in the heat source.","PeriodicalId":145224,"journal":{"name":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling\",\"authors\":\"M. Kopeć, B. Więcek\",\"doi\":\"10.23919/MIXDES49814.2020.9155993\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel methodology of thermal impedance measurement by temperature monitoring out of the heat source in a power transistor is presented. A low-cost Infra-Red (IR) head is used to register evolution of temperature after step-function powering. A dedicated power generator has been developed to synchronize temperature recording with power dissipation in a device. Estimation of temperature in the heat source is performed by 3D FEM modelling of multilayer transistor structure. It allows fitting the measurement and simulation results to achieve the classically-defined thermal impedance in the heat source.\",\"PeriodicalId\":145224,\"journal\":{\"name\":\"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/MIXDES49814.2020.9155993\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MIXDES49814.2020.9155993","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling
A novel methodology of thermal impedance measurement by temperature monitoring out of the heat source in a power transistor is presented. A low-cost Infra-Red (IR) head is used to register evolution of temperature after step-function powering. A dedicated power generator has been developed to synchronize temperature recording with power dissipation in a device. Estimation of temperature in the heat source is performed by 3D FEM modelling of multilayer transistor structure. It allows fitting the measurement and simulation results to achieve the classically-defined thermal impedance in the heat source.
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