gan - hemt的开关行为分析

Michael Ebli, M. Pfost
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引用次数: 3

摘要

氮化镓高电子迁移率晶体管(gan - hemt)具有低电容,在需要硬导通的应用中可以实现低开关损耗。低开关损耗意味着快速开关;因此,快速电压和电流瞬变发生。然而,即使对于高度优化的系统,这些瞬态也可能受到封装和布局寄生的限制。此外,快速开关需要输入电容的快速充电,因此具有高栅极电流。本文讨论了gan - hemt的共源电感和栅极驱动电源电压对开关速度的限制。模拟了GaN-HEMT的导通行为,详细描述了寄生效应和栅极驱动电源电压对开关损耗的影响。此外,在漏源电压为500V,漏源电流为60a的优化布局下进行了测量。
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An analysis of the switching behavior of GaN-HEMTs
Gallium nitride high electron mobility transistors (GaN-HEMTs) have low capacitances and can achieve low switching losses in applications where hard turn-on is required. Low switching losses imply a fast switching; consequently, fast voltage and current transients occur. However, these transients can be limited by package and layout parasitics even for highly optimized systems. Furthermore, a fast switching requires a fast charging of the input capacitance, hence a high gate current. In this paper, the switching speed limitations of GaN-HEMTs due to the common source inductance and the gate driver supply voltage are discussed. The turn-on behavior of a GaN-HEMT is simulated and the impact of the parasitics and the gate driver supply voltage on the switching losses is described in detail. Furthermore, measurements are performed with an optimized layout for a drain-source voltage of 500V and a drain-source current up to 60 A.
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