用于宽带24GHz和28GHz 5G解决方案的封装高功率前端模块

M. Ayad, A. Couturier, P. Poilvert, L. Marechal, P. Auxemery
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引用次数: 1

摘要

介绍了工作在24-31GHz带宽范围内的宽带塑料低成本封装5G高功率前端(HPFE)的实现及其特点。该演示器包括采用混合技术实现的发射和接收路径:150nm碳化硅上的氮化镓(AlGaN/GaN on SiC)和150nm砷化镓(GaAs)。发射路径(Tx)的连续波(CW)测量功率结果表明,在24-31GHz带宽下,最大输出功率(POUT,Tx)高于2W (33.5dBm),漏极效率(DE)为25%,功率附加效率(PAE)为24%,插入增益(GI,Tx)为36dB。接收器路径(Rx)在相同带宽下的最大输出功率(POUT,Rx)为30mW (15.5dBm),平均噪声系数(NF)为3.6dB,相关插入增益(GI,Rx)为20dB。我们研究了几种具有25/50和100MHz信道间隔的M-QAM调制信号的HPFE/Tx线性度,并使用数字预失真(DPD)在17dBm至25dBm的平均输出功率范围内导致48dBc的相邻信道泄漏比(ACLR)和40dB的均方误差(MSE)。将线性性能与专用于点对点电信应用的另外两种线性GaAs放大器(PA1和PA2)的线性性能进行了比较:HPFE具有与更高效率相关的相似线性性能。由于混合技术的方法,在集成、电气性能和成本方面的优化权衡已经得到证明。
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Packaged High Power Frond-End Module for Broadband 24GHz & 28GHz 5G solutions
This paper presents the realization and characteristics of broadband plastic low cost packaged 5G High Power Frond-End (HPFE) operating in 24-31GHz bandwidth. This demonstrator includes a Transmit and Receive paths realized on mixed technologies: 150nm Gallium Nitride on Silicon Carbide (AlGaN/GaN on SiC) and 150nm Gallium Arsenide (GaAs).Continuous Wave (CW) measured power results of the Transmit path (Tx) demonstrates a maximum output power (POUT,Tx) higher than 2W (33.5dBm) with 25% drain efficiency (DE), 24% power added efficiency (PAE), and 36dB of insertion gain (GI,Tx) in the 24-31GHz bandwidth. The receiver path (Rx) presents an maximum output power (POUT,Rx) of 30mW (15.5dBm) and an average Noise Figure (NF) of 3.6dB with an associated Insertion Gain (GI,Rx) of 20dB in the same bandwidth.The HPFE/Tx linearity has been investigated with several M-QAM modulation signals with 25/50 and 100MHz channel spacing and using Digital Pre-Distortion (DPD) leading to 48dBc Adjacent Channel Leakage Ratio (ACLR) and 40dB Mean Squared Error (MSE) for average output powers ranging from 17dBm to 25dBm. The linearity performances have been compared to the ones obtained with two other linear GaAs amplifiers (PA1 and PA2) dedicated to point to point telecommunications application: the HPFE presents similar linearity performances associated to a higher efficiency.Thanks to the mixed technologies approach, an optimized trade-off in terms of integration, electrical performances and cost has been demonstrated.
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