A versatile electrothermal model of an integrated full bridge device taking into account various boundary conditions

The authors present an analytical electrothermal model of an integrated full-bridge power converter for PSpice. It combines a thermal RC-network including thermal coupling between the DMOS devices with an electrothermal model for each DMOSFET. A comparison between thermal simulation and FEM analysis of an commercially available module is given and, as an application example, the authors show the simulation of switching on a DC motor with the full-bridge device and an approach to include basic printed circuit board characteristics into the simulation.