双臂集群工具的性能模型

Kyungsu Park, Younghun Ahn, J. R. Morrison
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引用次数: 5

摘要

在半导体晶圆制造中,带有双臂晶圆运输机器人的集束工具是很常见的。然而,现有的建模方法要么受到计算复杂性(例如,Petri网,详细模拟)和由此导致的洞察力缺乏的影响,要么受到简单性及其随之而来的准确性和表达性损失的影响(例如,Ax+B模型)。展望在工具配置优化、性能评估和晶圆厂范围内的仿真模型中的应用,我们为这些集群工具的周期时间开发了表达性和计算上易于处理的方程和递推。该模型包括瞬态周期和机器人行为,以表达刀具性能的非线性。这些模型结合了这些工具对具有一定数量晶圆的批次的亲和力。我们对双臂聚类工具进行模拟,以评估模型的质量,并比较各种近似方法之间的性能和计算复杂性。
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Performance models for dual-arm cluster tools
Cluster tools with a dual-arm wafer transport robot are common in semiconductor wafer manufacturing. However, existing modeling methods suffer either from computational complexity (e.g., Petri nets, detailed simulation) and the resulting dearth of insight or from simplicity and its attendant loss of accuracy and expression (e.g., Ax+B models). Looking toward application in tool configuration optimization, performance evaluation and fab-wide simulation models, we develop expressive and computationally tractable equations and recursions for the cycle time of such cluster tools. The models include transient periods and robot behavior to express nonlinearities in tool performance. The models incorporate the affinity of such tools toward lots with certain numbers of wafers. We conduct simulations of dual-arm cluster tools to assess the quality of our models and compare performance and computational complexity between various approximation methods.
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