{"title":"用应力变化实验研究铝的低温蠕变:吸引结的热活化","authors":"Y. Prasad, D. Sastry, K. Vasu","doi":"10.1179/030634570790444103","DOIUrl":null,"url":null,"abstract":"AbstractLow-temperature creep in aluminium has been studied by means of change-in-stress experiments. The value of the flow parameter B (= ∆ ln έ/∆τ) was higher for creep following stress decrements than that for creep following increments, the difference being negligible at higher stresses. Among the various possible mechanisms considered, a model based on the formation of attractive junctions following a stress decrement, causing a change in the number of dislocation elements participating in the activation event, explains the effect satisfactorily.","PeriodicalId":103313,"journal":{"name":"Metal Science Journal","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A Study of Low-Temperature Creep in Aluminium by Change-in-Stress Experiments: Thermal Activation of Attractive Junctions\",\"authors\":\"Y. Prasad, D. Sastry, K. Vasu\",\"doi\":\"10.1179/030634570790444103\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"AbstractLow-temperature creep in aluminium has been studied by means of change-in-stress experiments. The value of the flow parameter B (= ∆ ln έ/∆τ) was higher for creep following stress decrements than that for creep following increments, the difference being negligible at higher stresses. Among the various possible mechanisms considered, a model based on the formation of attractive junctions following a stress decrement, causing a change in the number of dislocation elements participating in the activation event, explains the effect satisfactorily.\",\"PeriodicalId\":103313,\"journal\":{\"name\":\"Metal Science Journal\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Metal Science Journal\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1179/030634570790444103\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metal Science Journal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1179/030634570790444103","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Study of Low-Temperature Creep in Aluminium by Change-in-Stress Experiments: Thermal Activation of Attractive Junctions
AbstractLow-temperature creep in aluminium has been studied by means of change-in-stress experiments. The value of the flow parameter B (= ∆ ln έ/∆τ) was higher for creep following stress decrements than that for creep following increments, the difference being negligible at higher stresses. Among the various possible mechanisms considered, a model based on the formation of attractive junctions following a stress decrement, causing a change in the number of dislocation elements participating in the activation event, explains the effect satisfactorily.