{"title":"紧凑型扫描掩模，用于3-D连接组件标签","authors":"W. Premchaiswadi, P. Sutheebanjard","doi":"10.1109/ICTKE.2012.6152396","DOIUrl":null,"url":null,"abstract":"Connected component labeling is the underlying technique that is typically used in today's digital image processing for both 2-dimensional and 3-dimensional images. This research analyzes the scan mask for connected components labeling and proposes a new scan mask for 3-dimensional connected components labeling operation (26-connectivity), in which the number of pixels to be inspected is reduced from 14 pixels to 8 pixels.","PeriodicalId":235347,"journal":{"name":"2011 Ninth International Conference on ICT and Knowledge Engineering","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-02-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Compact scan mask for 3-D connected components labeling\",\"authors\":\"W. Premchaiswadi, P. Sutheebanjard\",\"doi\":\"10.1109/ICTKE.2012.6152396\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Connected component labeling is the underlying technique that is typically used in today's digital image processing for both 2-dimensional and 3-dimensional images. This research analyzes the scan mask for connected components labeling and proposes a new scan mask for 3-dimensional connected components labeling operation (26-connectivity), in which the number of pixels to be inspected is reduced from 14 pixels to 8 pixels.\",\"PeriodicalId\":235347,\"journal\":{\"name\":\"2011 Ninth International Conference on ICT and Knowledge Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-02-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 Ninth International Conference on ICT and Knowledge Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICTKE.2012.6152396\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 Ninth International Conference on ICT and Knowledge Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICTKE.2012.6152396","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compact scan mask for 3-D connected components labeling
Connected component labeling is the underlying technique that is typically used in today's digital image processing for both 2-dimensional and 3-dimensional images. This research analyzes the scan mask for connected components labeling and proposes a new scan mask for 3-dimensional connected components labeling operation (26-connectivity), in which the number of pixels to be inspected is reduced from 14 pixels to 8 pixels.
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