用于光波通信的高速电子器件

Optical Fiber Communication Conference and Exhibit Pub Date : 2002-03-17 DOI:10.1109/OFC.2002.1036355

Y. Chen, Y. Baeyens, C. Liu, R. Kopf, C. Chen, Y. Yang, J. Frackoviak, A. Tate, A. Leven, P. Paschke, M. Berger, J. Weiner, K. Tu, G. Georgiou, P. Roux, V. Houstma, U. Koc

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引用次数: 2

摘要

在这次演讲中，我们将研究半导体IC技术，如CMOS器件，asic, hemt, hbt，将如何影响这些功能模块在40 Gbps下的性能，以及利用这些IC技术实现收发器在100+ Gbps下传输数据速率的未来前景。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High speed electronics for lightwave communications

In this talk, we will examine how semiconductor IC technologies such as CMOS devices, ASICs, HEMTs, HBTs, will impact the performance of these functional blocks at 40 Gbps as well as the future prospective of utilizing these IC technologies to realize transceivers to transport data rate in the 100+ Gbps regime.

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Optical Fiber Communication Conference and Exhibit

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