{"title":"芯片对芯片通信的集成自由空间光互连","authors":"J. Jahns","doi":"10.1109/MPPOI.1998.682122","DOIUrl":null,"url":null,"abstract":"Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects.","PeriodicalId":248808,"journal":{"name":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Integrated free-space optical interconnects for chip-to-chip communications\",\"authors\":\"J. Jahns\",\"doi\":\"10.1109/MPPOI.1998.682122\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects.\",\"PeriodicalId\":248808,\"journal\":{\"name\":\"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-06-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MPPOI.1998.682122\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MPPOI.1998.682122","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated free-space optical interconnects for chip-to-chip communications
Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects.
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