Sae-Won Lee, A. Parameswaran, R. Vaughan, A. Mahanfar
{"title":"基于高频SU-8的三维毫米波天线传输线","authors":"Sae-Won Lee, A. Parameswaran, R. Vaughan, A. Mahanfar","doi":"10.1109/IMWS.2009.4814918","DOIUrl":null,"url":null,"abstract":"A fabrication method and characterization of transmission lines for 3-D millimeter-wave antennas are presented using a polymer micro-electro-mechanical-systems (MEMS) fabrication process. The fabrication process steps are performed at low temperatures and are compatible for on-chip CMOS integration. Blanket metal deposition is applied to the wafer to coat the structures with Au and Cr and electrical isolation is achieved by anchor designs.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High Frequency SU-8 Based Transmission Line for 3-D Millimeter-wave Antennas\",\"authors\":\"Sae-Won Lee, A. Parameswaran, R. Vaughan, A. Mahanfar\",\"doi\":\"10.1109/IMWS.2009.4814918\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A fabrication method and characterization of transmission lines for 3-D millimeter-wave antennas are presented using a polymer micro-electro-mechanical-systems (MEMS) fabrication process. The fabrication process steps are performed at low temperatures and are compatible for on-chip CMOS integration. Blanket metal deposition is applied to the wafer to coat the structures with Au and Cr and electrical isolation is achieved by anchor designs.\",\"PeriodicalId\":368866,\"journal\":{\"name\":\"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMWS.2009.4814918\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMWS.2009.4814918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High Frequency SU-8 Based Transmission Line for 3-D Millimeter-wave Antennas
A fabrication method and characterization of transmission lines for 3-D millimeter-wave antennas are presented using a polymer micro-electro-mechanical-systems (MEMS) fabrication process. The fabrication process steps are performed at low temperatures and are compatible for on-chip CMOS integration. Blanket metal deposition is applied to the wafer to coat the structures with Au and Cr and electrical isolation is achieved by anchor designs.