生物传感器中覆盖场效应晶体管结构的数值模拟

C. Ibau, M. K. Md Arshad, M. N. Md Nor, R. M. Ayub, R. A. Rahim, U. Hashim
{"title":"生物传感器中覆盖场效应晶体管结构的数值模拟","authors":"C. Ibau, M. K. Md Arshad, M. N. Md Nor, R. M. Ayub, R. A. Rahim, U. Hashim","doi":"10.1109/SMELEC.2016.7573602","DOIUrl":null,"url":null,"abstract":"The paper reports on numerical simulation of underlap field effect transistor (FET) device architecture on silicon-on-insulator (SOI) for a robustness used in biosensors application. By using the Silvaco ATLAS device simulator, the simulation is aimed at elucidating the effect of length of underlap, location of underlap, device etching profiles, and effect of back-gate biasing on the magnitude of drain current (ID). It is shown that the longer underlap and an etched silicon profile introduced higher parasitic resistance, thus decreasing the ID response. The ID response is higher for device with underlap between the gate-drain terminals as compared to gate-source terminals. Positive back-gate bias increases and shifts the current, and reduced the threshold voltage required to turn on the device.","PeriodicalId":169983,"journal":{"name":"2016 IEEE International Conference on Semiconductor Electronics (ICSE)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical simulation of underlap FET device architecture for biosensor applications\",\"authors\":\"C. Ibau, M. K. Md Arshad, M. N. Md Nor, R. M. Ayub, R. A. Rahim, U. Hashim\",\"doi\":\"10.1109/SMELEC.2016.7573602\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper reports on numerical simulation of underlap field effect transistor (FET) device architecture on silicon-on-insulator (SOI) for a robustness used in biosensors application. By using the Silvaco ATLAS device simulator, the simulation is aimed at elucidating the effect of length of underlap, location of underlap, device etching profiles, and effect of back-gate biasing on the magnitude of drain current (ID). It is shown that the longer underlap and an etched silicon profile introduced higher parasitic resistance, thus decreasing the ID response. The ID response is higher for device with underlap between the gate-drain terminals as compared to gate-source terminals. Positive back-gate bias increases and shifts the current, and reduced the threshold voltage required to turn on the device.\",\"PeriodicalId\":169983,\"journal\":{\"name\":\"2016 IEEE International Conference on Semiconductor Electronics (ICSE)\",\"volume\":\"71 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Conference on Semiconductor Electronics (ICSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2016.7573602\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Conference on Semiconductor Electronics (ICSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2016.7573602","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文报道了基于绝缘体上硅(SOI)的下迭场效应晶体管(FET)器件结构的数值模拟,用于生物传感器的鲁棒性研究。利用Silvaco ATLAS器件模拟器进行仿真,旨在阐明欠接长度、欠接位置、器件刻蚀轮廓和后门偏置对漏极电流(ID)大小的影响。结果表明,较长的下搭和蚀刻的硅轮廓引入了较高的寄生电阻,从而降低了内径响应。与栅极-源端相比,栅极-漏极端之间有搭接的器件的ID响应更高。正的反向偏置增加和移动电流,并降低开启器件所需的阈值电压。
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Numerical simulation of underlap FET device architecture for biosensor applications
The paper reports on numerical simulation of underlap field effect transistor (FET) device architecture on silicon-on-insulator (SOI) for a robustness used in biosensors application. By using the Silvaco ATLAS device simulator, the simulation is aimed at elucidating the effect of length of underlap, location of underlap, device etching profiles, and effect of back-gate biasing on the magnitude of drain current (ID). It is shown that the longer underlap and an etched silicon profile introduced higher parasitic resistance, thus decreasing the ID response. The ID response is higher for device with underlap between the gate-drain terminals as compared to gate-source terminals. Positive back-gate bias increases and shifts the current, and reduced the threshold voltage required to turn on the device.
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