{"title":"功率和信号完整性感知设计与分析的全球数模联合仿真方法","authors":"S. Wane, G. Boguszewski","doi":"10.1109/EMICC.2008.4772326","DOIUrl":null,"url":null,"abstract":"In this paper a global co-simulation methodology for concurrent/simultaneous analysis of passive and active analog/digital parts is proposed. An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Dedicated real-world NXP-Philips-Semiconductors active modules mounted on test-board have been designed and measured for validation of the proposed co-simulation methodology. Full-wave electromagnetic modeling, broadband SPICE compact model extractions and measurement results are successfully compared.","PeriodicalId":344657,"journal":{"name":"2008 European Microwave Integrated Circuit Conference","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Global Digital-Analog Co-Simulation Methodology for Power and Signal Integrity aware Design and Analysis\",\"authors\":\"S. Wane, G. Boguszewski\",\"doi\":\"10.1109/EMICC.2008.4772326\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper a global co-simulation methodology for concurrent/simultaneous analysis of passive and active analog/digital parts is proposed. An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Dedicated real-world NXP-Philips-Semiconductors active modules mounted on test-board have been designed and measured for validation of the proposed co-simulation methodology. Full-wave electromagnetic modeling, broadband SPICE compact model extractions and measurement results are successfully compared.\",\"PeriodicalId\":344657,\"journal\":{\"name\":\"2008 European Microwave Integrated Circuit Conference\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 European Microwave Integrated Circuit Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMICC.2008.4772326\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 European Microwave Integrated Circuit Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMICC.2008.4772326","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Global Digital-Analog Co-Simulation Methodology for Power and Signal Integrity aware Design and Analysis
In this paper a global co-simulation methodology for concurrent/simultaneous analysis of passive and active analog/digital parts is proposed. An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Dedicated real-world NXP-Philips-Semiconductors active modules mounted on test-board have been designed and measured for validation of the proposed co-simulation methodology. Full-wave electromagnetic modeling, broadband SPICE compact model extractions and measurement results are successfully compared.
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