光子元件与子系统可靠性建模

D. Nicholls, A. Avak, J. Mazurowski
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引用次数: 3

摘要

本文总结的项目重点是开发一种与MIL-HDBK-217兼容的光子组件和组件可靠性预测方法,以便系统级设计人员可以有效地估计使用光纤和光子学的系统的可靠性。本研究涉及的光子部件类型包括:wdm(薄膜和光纤)、耦合器(光纤)、抽头、分带器、隔离器、光纤、激光泵浦模块、光电二极管、发射器、接收器、收发器、滤波器、可变光衰减器(VOAs)、光纤连接器、电缆组件和接头。
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Photonic component and subsystem reliability modeling
The focus of the project being summarized herein is to develop a method for predicting the reliability of photonic components and assemblies that is compatible with MIL-HDBK-217, so that system level designers can efficiently estimate the reliability of systems using fiber optics and photonics. Photonic part types being addressed in this study are: WDMs (Thin film and Fiber based), Couplers (fiber), Taps, Bandsplitters, Isolators, Optical Fiber, Laser pump modules, Photodiodes, Transmitters, Receivers, Transceivers, Filters, Variable Optical Attenuators (VOAs), Fiber connectors, Cable assemblies, and Splices.
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