{"title":"一种用于有源相控阵天线的高集成多功能微波数字复合板的设计","authors":"Chao Yan, Z. Zhan, Hao Song, Shuaishuai Hu","doi":"10.1109/ICICM50929.2020.9292205","DOIUrl":null,"url":null,"abstract":"A Ka band highly integrated multifunctional board for active phased array antenna is proposed based on multilayer microwave and digital composite board technology. The antenna radiation array, RF feed network, power divider network, beam control distribution network and other circuits are integrated in the board. The key microwave circuits and interconnections in the multifunctional board are analyzed and optimized by simulation software. The simulation results show that the design satisfied the requirements of the system appropriately. The size of multifunctional board is only $173\\text{mm}\\times 40\\text{mm}\\times 3.4\\text{mm}$, and the total weight is less than 60g, which has a bright application prospect on the platforms where the volume and weight are strictly limited.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of a Highly Integrated Multifunctional Microwave Digital Composite Board for Active Phased Array Antenna\",\"authors\":\"Chao Yan, Z. Zhan, Hao Song, Shuaishuai Hu\",\"doi\":\"10.1109/ICICM50929.2020.9292205\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Ka band highly integrated multifunctional board for active phased array antenna is proposed based on multilayer microwave and digital composite board technology. The antenna radiation array, RF feed network, power divider network, beam control distribution network and other circuits are integrated in the board. The key microwave circuits and interconnections in the multifunctional board are analyzed and optimized by simulation software. The simulation results show that the design satisfied the requirements of the system appropriately. The size of multifunctional board is only $173\\\\text{mm}\\\\times 40\\\\text{mm}\\\\times 3.4\\\\text{mm}$, and the total weight is less than 60g, which has a bright application prospect on the platforms where the volume and weight are strictly limited.\",\"PeriodicalId\":364285,\"journal\":{\"name\":\"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICM50929.2020.9292205\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICM50929.2020.9292205","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of a Highly Integrated Multifunctional Microwave Digital Composite Board for Active Phased Array Antenna
A Ka band highly integrated multifunctional board for active phased array antenna is proposed based on multilayer microwave and digital composite board technology. The antenna radiation array, RF feed network, power divider network, beam control distribution network and other circuits are integrated in the board. The key microwave circuits and interconnections in the multifunctional board are analyzed and optimized by simulation software. The simulation results show that the design satisfied the requirements of the system appropriately. The size of multifunctional board is only $173\text{mm}\times 40\text{mm}\times 3.4\text{mm}$, and the total weight is less than 60g, which has a bright application prospect on the platforms where the volume and weight are strictly limited.