埋地三维硅光子学点尺寸转换器

2021 IEEE 17th International Conference on Group IV Photonics (GFP) Pub Date : 2021-12-01 DOI:10.1109/GFP51802.2021.9673849

W. Zhang, M. Ebert, J. Reynolds, B. Chen, X. Yan, H. Du, M. Banakar, D. Tran, C. Littlejohns, G. Reed, D. Thomson

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引用次数: 0

摘要

在绝缘体硅光子学平台上首次展示了一种埋地三维光斑尺寸转换器，实现了微米和亚微米尺度波导之间的低损耗光模式转换，为共封装光学应用中光纤(芯片)到芯片的耦合提供了新的解决方案。

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Buried 3D silicon photonics spot-size convertors

A buried three-dimensional spot size converter has been demonstrated in silicon on insulator photonics platform for the first time enabling low loss optical mode conversion between micron and submicron scale waveguides, which provides new solutions for fibre (chip) to chip coupling for co-package optics applications.

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2021 IEEE 17th International Conference on Group IV Photonics (GFP)

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