{"title":"Ada电子战建模","authors":"Kurt D. Welker, M. W. Snyder, Jerry A. Goetsch","doi":"10.1145/260303.260308","DOIUrl":null,"url":null,"abstract":"A liquefiable peroxide reactive molding composition comprising a reaction product of a polyol, an organic polyisocyanate and a hydroxyl ethylenic containing compound, said liquifiable composition having a free NCO content of less than about 0.3% by weight and an organic peroxide and being useful as an injection molding composition and as an adhesive that is essentially insensitive to atmospheric moisture.","PeriodicalId":297156,"journal":{"name":"Addendum to the proceedings on Object-oriented programming systems, languages, and applications","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Ada electronic combat modeling\",\"authors\":\"Kurt D. Welker, M. W. Snyder, Jerry A. Goetsch\",\"doi\":\"10.1145/260303.260308\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A liquefiable peroxide reactive molding composition comprising a reaction product of a polyol, an organic polyisocyanate and a hydroxyl ethylenic containing compound, said liquifiable composition having a free NCO content of less than about 0.3% by weight and an organic peroxide and being useful as an injection molding composition and as an adhesive that is essentially insensitive to atmospheric moisture.\",\"PeriodicalId\":297156,\"journal\":{\"name\":\"Addendum to the proceedings on Object-oriented programming systems, languages, and applications\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Addendum to the proceedings on Object-oriented programming systems, languages, and applications\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/260303.260308\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Addendum to the proceedings on Object-oriented programming systems, languages, and applications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/260303.260308","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A liquefiable peroxide reactive molding composition comprising a reaction product of a polyol, an organic polyisocyanate and a hydroxyl ethylenic containing compound, said liquifiable composition having a free NCO content of less than about 0.3% by weight and an organic peroxide and being useful as an injection molding composition and as an adhesive that is essentially insensitive to atmospheric moisture.
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