开发热电性能增强的pbte基超晶格结构

J. Caylor, K. Coonley, J. Stuart, S. Nangaoy, T. Colpitts, R. Venkatasubramanian
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引用次数: 2

摘要

与标准的PbTeSe合金相比,利用简单的蒸发技术制备n型PbTe/PbTe/sub 0.75/Se/sub 0.25/结构获得了高质量的超晶格薄膜,显著降低了晶格热导率,并有可能提高热电器件的性能。使用PbTe/PbTeSe超晶格在交叉平面方向上,PbTeSe合金的室温晶格导热系数降低了两倍或更多。利用这一优势,我们已经开始表征PbTe/PbTeSe超晶格器件的交叉平面ZT,包括为PbTe材料系统开发适当的欧姆接触。我们将讨论改善欧姆接触的各种器件工艺技术。本文报道了用瞬态法测量n型PbTe/PbTe/sub 0.75/Se/sub 0.25/器件结构的交叉面品质曲线。此外,这些结果将与平面内电阻率和塞贝克系数的温度相关测量相结合,以获得增强热电性能的证据。本文将讨论类似p型薄膜的结果,以及在Bi/sub 2/Te/sub 3/上生长的异质外延薄膜的初步数据。
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Developing PbTe-based superlattice structures with enhanced thermoelectric performance
The fabrication of n-type PbTe/PbTe/sub 0.75/Se/sub 0.25/ structures using a simple evaporation technique has yielded high-quality superlattice films, a significant reduction in lattice thermal conductivity and potentially enhanced thermoelectric device performance, compared to standard PbTeSe alloys. The room temperature lattice thermal conductivity of PbTeSe alloys have been reduced by a factor of two or more using PbTe/PbTeSe superlattices in the cross-plane direction. Using this advantage, we have begun characterizing the cross-plane ZT of PbTe/PbTeSe superlattice devices, including the development of appropriate Ohmic contacts for the PbTe-material system. We will discuss various device process technologies for improved Ohmic contacts. The room-temperature measurement of cross-plane figure-of-merit in n-type PbTe/PbTe/sub 0.75/Se/sub 0.25/ device structure by the transient method will be reported. Also, these results will be combined with temperature dependent measurements of in-plane resistivity and Seebeck coefficient to yield evidence of enhanced thermoelectric performance. The results from similar p-type films, as well as preliminary data on heteroepitaxial films grown on Bi/sub 2/Te/sub 3/ will be discussed.
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