{"title":"高性能MEMS惯性传感器制造平台","authors":"J. DeNatale, P. Stupar, S. Martel, J. Lachance","doi":"10.1109/PLANS53410.2023.10140045","DOIUrl":null,"url":null,"abstract":"We present recent progress on a high-performance inertial sensor manufacturing processes implemented in a volume compatible 200 mm wafer diameter production environment. The baseline process, derived from Teledyne DALSA's MIDIS™ process platform, incorporates critical design elements specifically designed for navigation-grade device realization. The process enables considerable flexibility to support a broad range of device designs, facilitating the rapid transition of new device concepts to volume production. Recent progress has demonstrated the flexibility of the process through application to alternate gyro resonator device designs. Extensive refinement of the process has been implemented to improve manufacturing metrics and device performance.","PeriodicalId":344794,"journal":{"name":"2023 IEEE/ION Position, Location and Navigation Symposium (PLANS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Manufacturing Platform for High-Performance MEMS Inertial Sensors\",\"authors\":\"J. DeNatale, P. Stupar, S. Martel, J. Lachance\",\"doi\":\"10.1109/PLANS53410.2023.10140045\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present recent progress on a high-performance inertial sensor manufacturing processes implemented in a volume compatible 200 mm wafer diameter production environment. The baseline process, derived from Teledyne DALSA's MIDIS™ process platform, incorporates critical design elements specifically designed for navigation-grade device realization. The process enables considerable flexibility to support a broad range of device designs, facilitating the rapid transition of new device concepts to volume production. Recent progress has demonstrated the flexibility of the process through application to alternate gyro resonator device designs. Extensive refinement of the process has been implemented to improve manufacturing metrics and device performance.\",\"PeriodicalId\":344794,\"journal\":{\"name\":\"2023 IEEE/ION Position, Location and Navigation Symposium (PLANS)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE/ION Position, Location and Navigation Symposium (PLANS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PLANS53410.2023.10140045\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE/ION Position, Location and Navigation Symposium (PLANS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PLANS53410.2023.10140045","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Manufacturing Platform for High-Performance MEMS Inertial Sensors
We present recent progress on a high-performance inertial sensor manufacturing processes implemented in a volume compatible 200 mm wafer diameter production environment. The baseline process, derived from Teledyne DALSA's MIDIS™ process platform, incorporates critical design elements specifically designed for navigation-grade device realization. The process enables considerable flexibility to support a broad range of device designs, facilitating the rapid transition of new device concepts to volume production. Recent progress has demonstrated the flexibility of the process through application to alternate gyro resonator device designs. Extensive refinement of the process has been implemented to improve manufacturing metrics and device performance.
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