{"title":"多千兆信号互连设计中的非预期被动谐振结构","authors":"Kai Xiao, J. Hock, B. Bissonette, X. Ye","doi":"10.1109/ISEMC.2012.6351675","DOIUrl":null,"url":null,"abstract":"In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.","PeriodicalId":197346,"journal":{"name":"2012 IEEE International Symposium on Electromagnetic Compatibility","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Unintended passive resonant structures in interconnect designs for multi-gigabit signaling\",\"authors\":\"Kai Xiao, J. Hock, B. Bissonette, X. Ye\",\"doi\":\"10.1109/ISEMC.2012.6351675\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.\",\"PeriodicalId\":197346,\"journal\":{\"name\":\"2012 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2012.6351675\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2012.6351675","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Unintended passive resonant structures in interconnect designs for multi-gigabit signaling
In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.