多千兆信号互连设计中的非预期被动谐振结构

Kai Xiao, J. Hock, B. Bissonette, X. Ye
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引用次数: 0

摘要

在计算机系统设计中,印刷电路板(PCB)和封装设计者可能在不知不觉中忽略了关键的高q共振现象。这通常与不是预期信号路径的直接部分和/或未主动包含在典型信号完整性分析中的结构相关。一个由端接不当的“无连接”引脚引起的有害共振影响的例子揭示了与多千兆信号相关的一类新问题。
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Unintended passive resonant structures in interconnect designs for multi-gigabit signaling
In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.
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