计算封装与微波电路间寄生耦合的分析方法

T. Bolz, A. Beyer
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引用次数: 0

摘要

这一贡献的目的是推导出一个简单的数学模型来描述微带结构和金属屏蔽的谐振模式之间的电磁相互作用,其中提到的结构是为了避免辐射或抑制相邻电路之间的电耦合而内置的。利用基于电磁场方程的该模型,在市售电路模拟器中提取了考虑电、磁表面电流和腔模式相互作用的等效电路。算例和结果表明了该方法的适用性。
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Analytical approaches to calculating the parasitic coupling between packages and microwave circuits
The aim of this contribution is the derivation of a simple mathematical model to describe the electromagnetic interaction between the microstrip structure and the resonant modes of the metal shielding, in which the structure mentioned is built in either for avoiding the radiation or for suppressing electric coupling between adjacent circuit. By the help of this model based on the electromagnetic field equations equivalent electric circuits are extracted to consider the interaction between electric and magnetic surface currents and cavity modes in a commercially available circuit simulator. Several examples and their results show the applicability of the technique proposed.
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