晶圆级封装上再分配线图样的微波频率串扰模型

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967623

Myunghee Sung, Namhoon Kim, Junwoo Lee, Baekkyu Choi, Ikseong Park, J. Hong, Yongtae Kwon, K. Choi, Joungho Kim

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引用次数: 11

摘要

本文首次报导了5 GHz以上晶圆级封装上的再分配线串扰模型。提取的互感和互电容的最大值分别为220 pH/cm和98.2 fF/cm。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Microwave frequency crosstalk model of redistribution line patterns on Wafer Level Package

In this paper, we firstly report the crosstalk model of redistribution lines on Wafer Level Package over 5 GHz. The extracted mutual inductance and mutual capacitance have the maximum values of 220 pH/cm and 98.2 fF/cm, respectively.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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