{"title":"一种基于异质结构的紧凑型跨阻放大器的优化制造方法,以提高其元件的密度。错配诱导应力和材料孔隙率对工艺过程的影响","authors":"E. Pankratov","doi":"10.22271/27084477.2022.v3.i1a.20","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":224220,"journal":{"name":"International Journal of Electronic Devices and Networking","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An approach to optimize manufacturing of a compact transimpedance amplifier based on heterostructures to increase density of their elements. Influence of mismatch induced stress and porosity of materials on technological process\",\"authors\":\"E. Pankratov\",\"doi\":\"10.22271/27084477.2022.v3.i1a.20\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":224220,\"journal\":{\"name\":\"International Journal of Electronic Devices and Networking\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Electronic Devices and Networking\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.22271/27084477.2022.v3.i1a.20\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Electronic Devices and Networking","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.22271/27084477.2022.v3.i1a.20","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An approach to optimize manufacturing of a compact transimpedance amplifier based on heterostructures to increase density of their elements. Influence of mismatch induced stress and porosity of materials on technological process