{"title":"用于恶劣环境的谐振无线压力传感系统的ASIC,使用基于q的温度补偿,在- 40至150°C之间实现±2%的误差","authors":"M. Rocznik, F. Henrici, Remigius Has","doi":"10.1109/ISSCC.2012.6176975","DOIUrl":null,"url":null,"abstract":"Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"ASIC for a resonant wireless pressure-sensing system for harsh environments achieving ±2% error between −40 and 150°C using Q-based temperature compensation\",\"authors\":\"M. Rocznik, F. Henrici, Remigius Has\",\"doi\":\"10.1109/ISSCC.2012.6176975\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.\",\"PeriodicalId\":255282,\"journal\":{\"name\":\"2012 IEEE International Solid-State Circuits Conference\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Solid-State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2012.6176975\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2012.6176975","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
ASIC for a resonant wireless pressure-sensing system for harsh environments achieving ±2% error between −40 and 150°C using Q-based temperature compensation
Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.