利用片上网络诱导多核系统的热感知

David Atienza Alonso, E. Martinez
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引用次数: 13

摘要

由于晶体管密度的原因,技术规模对数字电路设计施加了不断增加的温度压力,特别是在高度集成的系统上,如多处理器片上系统(mpsoc)。因此,温度感知设计是强制性的,应该在设计的早期阶段进行。在本文中,我们提出了一种新的硬件基础设施来提供MPSoC架构的热控制,该基础设施基于利用基线系统的无互连作为主动组件,在分散在芯片周围的温度传感器之间进行通信和协调,以便全局监测实际温度。然后,热管理单元和时钟频率控制器根据运行时的温度要求调整处理元件的频率和电压。我们展示了在基于fpga的仿真框架上对现实生活中的4核MPSoC实施有效全局温度控制策略的基础设施的实验结果。
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Inducing Thermal-Awareness in Multicore Systems Using Networks-on-Chip
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to transistor density, especially on highly integrated systems, such as Multi-Processor Systems-on-Chip (MPSoCs). Therefore,temperature-aware design is mandatory and should be performed at the early design stages. In this paper we present a novel hardware infrastructure to provide thermal control of MPSoC architectures, which is based on exploiting the No interconnects of the baseline system as an active component to communicate and coordinate between temperature sensors scattered around the chip, in order to globally monitor the actual temperature. Then, a thermal management unit and clock frequency controllers adjust the frequency and voltage of the processing elements according to the temperature requirements at run-time. We show experimental results of the infrastructure to implement effective global temperature control policies for a real-life 4-core MPSoC,emulated on an FPGA-based emulation framework.
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