Andrzej Czerwoniec, T. Torzewicz, A. Samson, M. Janicki
{"title":"从冷却曲线测量中估计传热系数的温度依赖性","authors":"Andrzej Czerwoniec, T. Torzewicz, A. Samson, M. Janicki","doi":"10.1109/MIXDES.2015.7208555","DOIUrl":null,"url":null,"abstract":"This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device heating currents. These values are used then for transient simulations of the device with compact thermal models.","PeriodicalId":188240,"journal":{"name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Estimation of heat transfer coefficient temperature dependence from cooling curve measurements\",\"authors\":\"Andrzej Czerwoniec, T. Torzewicz, A. Samson, M. Janicki\",\"doi\":\"10.1109/MIXDES.2015.7208555\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device heating currents. These values are used then for transient simulations of the device with compact thermal models.\",\"PeriodicalId\":188240,\"journal\":{\"name\":\"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-08-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MIXDES.2015.7208555\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIXDES.2015.7208555","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Estimation of heat transfer coefficient temperature dependence from cooling curve measurements
This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device heating currents. These values are used then for transient simulations of the device with compact thermal models.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
