AC design issues for a multireference computer package

A potentially harmful form of ground bounce that takes place at board connector locations is described, modeled, and experimentally demonstrated. Ground bounce was successfully measured in a laboratory environment, on TCM boards detached from the mainframe. The laboratory analysis shows that the amplitude of the ground bounce can be reduced six-fold by increasing the number of reference planes. The risk of false triggering was greatly reduced for the TCM boards with additional reference planes. First-order theoretical modeling of ground bounce approximates the noise waveforms seen on the disturbed lines.<>