集成电路安装区电磁场减小幅度对PCB辐射发射的影响

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967603

S. Haga, K. Nakano, T. Sudo

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引用次数: 3

摘要

利用测试LSI和PCB对辐射机理和抑制措施进行了研究。在LSI操作模式中，I/O缓冲操作辐射最大，从电磁角度来看，LSI安装区表现为一个开口。结果表明，减小LSI安装区电磁场的措施是有效的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effects of decreasing extent of electromagnetic field at LSI mounting area on radiated emission from PCB

Radiating mechanism and reduction measures have been studied using test LSI and PCB. Among LSI operation modes, I/O buffer operation radiates the greatest amount of emission and shows that LSI mounting area behaves an opening from the electromagnetic viewpoint. The measure, decreasing extent of electromagnetic field at LSI mounting area, have been verified effective.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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