生物医学植入物的体系结构级容错

R. M. Seepers, C. Strydis, G. Gaydadjiev
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引用次数: 8

摘要

在本文中,我们描述了一种新的容错risc处理器架构的设计和实现,适用于针对生物医学植入物的设计框架。该设计同时针对软故障和硬故障,在有效结合和增强经典容错技术方面具有独创性。所提出的体系结构允许在运行时通过指令级可配置性在性能和容错性之间进行权衡。系统设计是根据UMC 90nm CMOS标准工艺合成的,并根据各种重复策略和测试顺序时间表的故障覆盖率、面积、平均功耗、总能耗和性能进行了评估。结果表明,在基准处理器上实现我们的技术所需的面积和功耗开销分别约为25%和32%。所建议架构的主要开销是性能(高达107%)和能耗(高达157%)。可以观察到,当目标是更高程度的容错时,平均功耗通常会降低。实验结果表明,该方法可以有效地安排测试序列,并且几乎可以容忍所有的软故障。所提出的体系结构的主要优点是所引入的体系结构级容错技术的高可移植性,在交换所需容错程度的处理器开销以及负担得起的面积和功耗开销方面的灵活性。
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Architecture-level fault-tolerance for biomedical implants
In this paper, we describe the design and implementation of a new fault-tolerant RISC-processor architecture suitable for a design framework targeting biomedical implants. The design targets both soft and hard faults and is original in efficiently combining as well as enhancing classic fault-tolerance techniques. The proposed architecture allows run-time tradeoffs between performance and fault tolerance by means of instruction-level configurability. The system design is synthesized for UMC 90nm CMOS standard-process and is evaluated in terms of fault coverage, area, average power consumption, total energy consumption and performance for various duplication policies and test-sequence schedules. It is shown that area and power overheads of approximately 25% and 32%, respectively, are required to implement our techniques on the baseline processor. The major overheads of the proposed architecture are performance (up to 107%) and energy consumption (up to 157%). It is observed that the average power consumption is often reduced when a higher degree of fault tolerance is targeted. It is shown that test sequences can effectively be scheduled during the available program stalls and that nearly all soft faults are tolerated by using instruction duplication. The main advantages of the proposed architecture are the high portability of the introduced architecture-level fault-tolerance techniques, the flexibility in trading processor overheads for required fault-tolerance degree as well as affordable area and power consumption overheads.
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