多核架构的变化感知热特性和管理

E. Kursun, Chen-Yong Cher
{"title":"多核架构的变化感知热特性和管理","authors":"E. Kursun, Chen-Yong Cher","doi":"10.1109/ICCD.2008.4751874","DOIUrl":null,"url":null,"abstract":"The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.","PeriodicalId":345501,"journal":{"name":"2008 IEEE International Conference on Computer Design","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":"{\"title\":\"Variation-aware thermal characterization and management of multi-core architectures\",\"authors\":\"E. Kursun, Chen-Yong Cher\",\"doi\":\"10.1109/ICCD.2008.4751874\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.\",\"PeriodicalId\":345501,\"journal\":{\"name\":\"2008 IEEE International Conference on Computer Design\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"35\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Conference on Computer Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2008.4751874\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2008.4751874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 35

摘要

动态功耗和热管理的准确性和效率都受到片上变化水平的影响,主要是因为动态热管理方案忽略了底层硬件的变化特性。我们提出了一种利用现有的片上传感器基础设施来改善多核架构中不同核之间固有的热平衡的技术。编译热传感器读数生成片上变化图,该图提供给系统电源/热管理,以有效地管理现有的片上变化。基于特殊测试芯片现场测量的实验分析表明,在没有性能损失的情况下,芯片上的加热减少了,从而在没有成本的情况下提高了芯片的功率/热效率。
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Variation-aware thermal characterization and management of multi-core architectures
The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.
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