{"title":"多核架构的变化感知热特性和管理","authors":"E. Kursun, Chen-Yong Cher","doi":"10.1109/ICCD.2008.4751874","DOIUrl":null,"url":null,"abstract":"The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.","PeriodicalId":345501,"journal":{"name":"2008 IEEE International Conference on Computer Design","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":"{\"title\":\"Variation-aware thermal characterization and management of multi-core architectures\",\"authors\":\"E. Kursun, Chen-Yong Cher\",\"doi\":\"10.1109/ICCD.2008.4751874\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.\",\"PeriodicalId\":345501,\"journal\":{\"name\":\"2008 IEEE International Conference on Computer Design\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"35\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Conference on Computer Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2008.4751874\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2008.4751874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Variation-aware thermal characterization and management of multi-core architectures
The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.