{"title":"Green在3D集成电路/封装应用中损耗多层电介质中的作用","authors":"Biyao Zhao, Siming Pan, J. Fan","doi":"10.1109/COMPEM.2018.8496730","DOIUrl":null,"url":null,"abstract":"Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.","PeriodicalId":221352,"journal":{"name":"2018 IEEE International Conference on Computational Electromagnetics (ICCEM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications\",\"authors\":\"Biyao Zhao, Siming Pan, J. Fan\",\"doi\":\"10.1109/COMPEM.2018.8496730\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.\",\"PeriodicalId\":221352,\"journal\":{\"name\":\"2018 IEEE International Conference on Computational Electromagnetics (ICCEM)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-03-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Conference on Computational Electromagnetics (ICCEM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/COMPEM.2018.8496730\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Computational Electromagnetics (ICCEM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMPEM.2018.8496730","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications
Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.
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