New efficient method of modeling electronics packages with power and ground planes

This paper introduces a new efficient numerical technique for the computation of fields in electronics packages with power and ground planes. This full wave approach can be conveniently integrated with circuit solvers. Skin-effect loss from metal planes and dielectric loss, together with the non-total reflections from outer edges of planes, can be easily incorporated. A special computation scheme was developed for handling vias between metal planes. Very good correlation has been achieved on printed-circuit test boards up to several GHz.