光滑类金刚石微悬臂阵列的制备

D. Sheeja, B. Tay, L. J. Yu, J. Miao, Y. Fu, D. Chua, W. Milne
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引用次数: 1

摘要

通过过滤阴极真空电弧(FCVA)沉积系统制备的非晶态碳膜具有表面光滑、硬度较高、摩擦学性能好、生物相容性好等优点。这些卓越的品质使它们适用于许多设备应用。然而,在相对较低的衬底偏压(如-80V)下制备的优质薄膜表现出较高的压应力,从而限制了薄膜的厚度。这一限制是克服应力减少,这是通过制备薄膜结合高衬底脉冲偏置。采用单步光刻技术成功制备了独立式类金刚石(DLC)微悬臂阵列。相对较厚(~1μm)、光滑(Rms ~0.75nm)、应力较低的衬底,通过FCVA沉积体系结合-5kV、900Hz、30μs的高脉冲偏置。采用各向异性湿法刻蚀Si,在40 wrt% KOH中,在23℃下刻蚀31小时。独立DLC微悬臂阵列的SEM图像显示,悬臂梁在自由端的最大横向挠度很低。偏转的定量测量也进行了使用光学剖面仪来验证。
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Fabrication Of Smooth Diamond-Like Carbon Microcantilever Arrays
The amorphous carbon films prepared by filtered cathodic vacuum arc (FCVA) deposition system are superior in nature with very smooth surface morphology, relatively high hardness, favorable tribological behaviour and excellent bio-compatibility. These exceptional qualities make them suitable for many device applications. However, the superior quality films prepared at relatively lower substrate bias such as -80V exhibits high compressive stress and thus limit the thickness of the film. This constraint is overcome by stress reduction, which is achieved by preparing the film in conjunction with high substrate pulse biasing. Free-standing Diamond-like Carbon (DLC) micro-cantiliver arrays were successfully fabricated by a single photolithography step. The relatively thick (~1μm), smooth (Rms ~0.75nm), low stress ( substrates, by the FCVA deposition system in conjunction with high substrate pulse biasing of -5kV, 900Hz and 30μs. The undecutting of the microstructure was carried out by anisotropic wet etching of Si in 40 wrt% KOH at 23°C for 31 hrs. The SEM image of the free-standing DLC micro-cantiliver arrays reveals that the maximum transverse deflection of the cantilever at the free end is quite low. The quantitative measurements of deflections were also carried out using an optical profiler to verify.
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